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AppleCare+
By proceeding you are agreeing to be bound by the Terms and Conditions of Sale and the AppleCare+ Terms & Conditions. These are standard terms on which we intend to rely. For your own benefit and protection it is important that you read the Terms and Conditions of Sale, the AppleCare+ Terms and Conditions, the Key Facts Document and the Initial Disclosure Document carefully before you do so. If you do not understand anything, or have any questions, please call the Apple Contact Centre www.apple.com/uk/support/.
I am resident in the United Kingdom, but I do not reside on the Isle of Man or the Channel Islands.
8 In-house Designed Superconductive Composite Heat Pipes 8 Superconductive composite heat pipes utilize groove and powder wick structure with dual variable heat pipe thickness for maximum efficiency of heat transfer.
Performance Dual Tower Redesigned dual tower maximizes performance and surface area with optimized fin density and thickness.
8 Heat Pipe Array Optimized lay out consisting of 8 heat pipes to ensure the heat is transferred to all fin area for efficient dissipation.
Expanded Copper Base Expanded surface area of nickel plated copper base provides seamless contact and complete coverage to target all heat zones. Base layer thickness minimized for faster heat conductivity as well as lower cooler height for improved case compatibility.
Dual Mobius Fans Equipped with dual variable Mobius fans for exceptional silence without compromising performance.
Dual Staggered Fan Setup Staggered 120mm and 135mm Mobius fans create ultimate Push-Pull setup for perfect airflow and air pressure to maximize heat dissipation.
Maximum RAM Clearance 120mm Mobius fan provides 42mm of RAM clearance to fit a wider range of builds without sacrificing performance.
All Black Stealth Design Stealth Series aluminum top cover and all black hardware provides a premium and clean design.
