Akasa Pro-grade+ 5026 heat sink compound 2.9 W/m·K 3 g

Excellent thermal performance, even at lo-pressures.

When every degree matters, get more from your cooler. Pro-grade+ silicone-tech evolution 5026 provides ultra thin bond lines, hi-thermal conductivity and hi-temperature stability, creating the ultimate thermal compound. It’s suitable for all CPUs and applications, from fanless cases to hi-performance coolers.