Akasa AK-460 Thermal Compound heat sink compound 3.3 W/m·K 3.5 g

Pro-Grade Silicone Technology Evolution leads to Outstanding Thermal Performance

Pro-grade Silicone technology evolution thermal compound delivers a stable and reliable thermal performance. Minimised resistance and maximised efficiency truly enables you to get more from your cooler. RoHS compliant.

Features
- Outstanding performance of heat transfer between CPU and heatsink.
- Low thermal resistance for heat transfer, 0.16cm²C/W @60 um BLT.
- Maximum thermal conductivity, 3.3W/mK.
- Electrically non-conductive.
- Low bleed under high pressure.
- Multi-language instructions included.